It has been announced today that Microsoft has selected its partner for the Xbox 2 chipset. Taiwan Semiconductor Manufacturing Co. will be charged with creating system-on-chip semiconductors for the upcoming console update.
System-on-chip semiconductors are bespoke chips that are used to integrate multiple electronic components required for a product into a single unit. TSMC will use Nexsys technology, its most advanced of process technologies. Nexsys is also employed in the production of the 90-nanometer process that is currently in pilot production as well as the now infamous 65-nanometer process, currently in development. It is thought that TSMC will use its standard 130-nanometer process for Xbox 2 components, though if it were to opt for 65-nanometer, this would elevate the new console to the dizzy heights enjoyed by Sony's fabled Cell microprocessor.
"TSMC has consistently demonstrated industry leadership in the development and deployment of highly advanced semiconductor process technologies for high-volume manufacturing," said Todd Holmdahl, Xbox General Manager of Microsoft Corporation. "It was this solid record of achievement that led us to work directly with TSMC on semiconductors targeted to our future game consoles products."
"Microsoft's future Xbox products and services will require leading-edge semiconductor technologies," added Dr. Rick Tsai, president of TSMC. "This agreement underscores the importance of a partnership between the two companies to identify the best technology platforms for Microsoft's future products. We look forward to a long and productive collaboration with Microsoft."
At his point in time, it is still not clear which of Microsoft’s current hardware partners' offerings will make use of TSMC's production capabilities. Under the terms of the agreement, Microsoft can incorporate any agreed Xbox 2 technology from either IBM, ATi and Silicon Integrated Systems into SOCs for future deployment.